Equipment Database

  • Our searchable equipment database is designed to provide specific information on Core Labs instruments.

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Total equipment found: 140

  • Nanofabrication Core Lab
    Thin Film


    ALD_tf
    Atomic Layer Deposition - ALD - is a thin film deposition method to fabricate ultrathin, highly uniform and conformal material layers for several applications. ALD uses sequential, self-limiting and surface controlled gas phase chemical reactions to achieve control of film growth in the nanometer/sub-nanometer thickness regime. Due to the film formation mechanism in which the gas will not react until it reaches the surface, the film growth proceeds by consecutive atomic layers from the surface. ALD film is dense, crack-, defect- and pinhole-free, and its thickness and structural and chemical characteristics can be precisely controlled on the atomic scale.
    Sample - a wide range of thin films including Al2O3, HfO2, TiO2, TiN, ZnO and Pt.

    Manufacturer: Oxford Instruments
    Model Number: FlexAI
    Location: Building 3, Level 2 West

  • Nanofabrication Core Lab
    Microfluidics


    Asylum AFM_mf
    The Asylum Research MFP-3D-BIO sets the standard for integrating AFM and optical microscopy for bioscience research. It is a bio-AFM with a xy imaging resolution of 500 pm, force measurement performance or application versatility, while integrating with a range of optical techniques and MFM capabilities. 

    ​Sample - Dry and wet samples.


    Manufacturer: Asylum
    Model Number: MFP-3D-Bio
    Location: Building 3, Level 2 East

  • Nanofabrication Core Lab
    Thin Film


    Ball Mill PM200_1_tf
    Retsch ball mills are used to grind and mix materials that are soft, medium hard to extremely hard, brittle or fibrous. Dry and wet grinding is possible, grinding with solvents is permissible.

    Sample - any powder or fibrous samples and not applicable for volatile, fuming or degassing materials.

    Manufacturer: Retsch
    Model Number: PM200
    Location: Building 3, Level 2 West

  • Nanofabrication Core Lab
    Thin Film


    Ball Mill PM200_2_tf

    Retsch ball mills are used to grind and mix materials that are soft, medium hard to extremely hard, brittle or fibrous. Dry and wet grinding is possible, grinding with solvents is permissible.


    Sample - any powder or fibrous samples and not applicable for volatile, fuming or degassing materials.

    Manufacturer: Retsch
    Model Number: PM200
    Location: Building 3, Level 2 West

  • Nanofabrication Core Lab
    Deposition and Characterization


    BIO-005 Bio Spectrophotometer_nf
    The Agilent 8453 UV-Vis instrument is a simple but powerful diode-array spectrophotometer capable of quickly acquiring liquid absorbance data in the spectral range from 190 to 1100 nm. It also includes biochemical analysis package for kinetics and thermal denaturation measurement.

    Sample - clear non-toxic, non-hazardous solution with a minimum of several ml. 

    Manufacturer: Agilent Technologies
    Model Number: 8453
    Location: Building 3, Level 0 West

  • Nanofabrication Core Lab
    Patterning


    BON-001 Wafer Bonder_nf
    Wafer bonding is a process by which two wafers of any materials adhere to each other either with macroscopic gluing, external force or voltage. It can be done at room temperature or elevated temperatures based on the requirement. The EVG 520IS is a semi-automated single-chamber unit with controlled piston pressure, vacuum, temperature and voltage, which can handle adhesive bonding, anodic bonding and hot embossing of 4, 6 and 8 inch wafers.

    Wafer - 4, 6, or 8 inches of silicon and glass wafers.

    Manufacturer: EVG
    Model Number: 520IS
    Location: Building 3, Level 0 West

  • Nanofabrication Core Lab
    Deposition and Characterization


    BON-002 Al Wire Bonder_nf
    Model 626 is a deep access, long reach wire bonder that can operate as a ball, wedge, bump or peg bonder. It is specifically designed for applications that require bonding at extreme height differences between 1st and 2nd bond and for bonding wires to sensitive devices such as gallium arsenide FET's and LED’s. 

    Sample - clean metal, silicon, III-V materials. Not applicable for glass and polymers.

    Manufacturer: Hybond, Inc
    Model Number: 626 12 10 A-2 30A 08
    Location: Building 3, Level 0 West

  • Nanofabrication Core Lab
    Deposition and Characterization


    BON-003 Gold Wire Bonder_nf
    Model 626 is a deep access, long reach wire bonder that can operate as a ball, wedge, bump or peg bonder. It is specifically designed for applications that require bonding at extreme height differences between 1st and 2nd bond and for bonding wires to sensitive devices such as gallium arsenide FET's and LED’s. 

    Sample - clean metal, silicon, III-V materials. Not applicable for glass and polymers.

    Manufacturer: Hybond, Inc
    Model Number: 626 12 10 A-2 30A 08
    Location: Building 3, Level 0 West

  • Nanofabrication Core Lab
    Deposition and Characterization


    BON-004 Dicing-wafer mount-tape release_nf
    The fully automatic wafer dicing machine model A-WD-2505 is a system for the ultra-high precision dicing of wafer and substrates sized up to 8-inch. It uses a thin two-inch blade rotated at high speeds by an ultra-precise air spindle with a built-in high-speed motor. There are two kinds of blades available to dice Si and glass wafers in NCL. 

    Sample - silicon wafer, III-V materials, glass, patterned wafers.

    Manufacturer: Accretech Europe GmbH
    Model Number: A-WD-2505
    Location: Building 3, Level 0 West

  • Nanofabrication Core Lab
    Deposition and Characterization


    BON-006 Die Attach_nf
    Accessory item of wafer dicing tool (BON-004) to move piece of diced wafer, and will be used together with BON-004. 

    Sample - any wafers.

    Manufacturer: Semiconductor Equipment Corp
    Model Number: 830
    Location: Building 3, Level 0 West