Equipment Database

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Total equipment found: 36

  • Nanofabrication Core Lab
    Deposition and Characterization


    BIO-005 Bio Spectrophotometer_nf
    The Agilent 8453 UV-Vis instrument is a simple but powerful diode-array spectrophotometer capable of quickly acquiring liquid absorbance data in the spectral range from 190 to 1100 nm. It also includes biochemical analysis package for kinetics and thermal denaturation measurement.

    Sample - clear non-toxic, non-hazardous solution with a minimum of several ml. 

    Manufacturer: Agilent Technologies
    Model Number: 8453
    Location: Building 3, Level 0 West

  • Nanofabrication Core Lab
    Deposition and Characterization


    BON-002 Al Wire Bonder_nf
    Model 626 is a deep access, long reach wire bonder that can operate as a ball, wedge, bump or peg bonder. It is specifically designed for applications that require bonding at extreme height differences between 1st and 2nd bond and for bonding wires to sensitive devices such as gallium arsenide FET's and LED’s. 

    Sample - clean metal, silicon, III-V materials. Not applicable for glass and polymers.

    Manufacturer: Hybond, Inc
    Model Number: 626 12 10 A-2 30A 08
    Location: Building 3, Level 0 West

  • Nanofabrication Core Lab
    Deposition and Characterization


    BON-003 Gold Wire Bonder_nf
    Model 626 is a deep access, long reach wire bonder that can operate as a ball, wedge, bump or peg bonder. It is specifically designed for applications that require bonding at extreme height differences between 1st and 2nd bond and for bonding wires to sensitive devices such as gallium arsenide FET's and LED’s. 

    Sample - clean metal, silicon, III-V materials. Not applicable for glass and polymers.

    Manufacturer: Hybond, Inc
    Model Number: 626 12 10 A-2 30A 08
    Location: Building 3, Level 0 West

  • Nanofabrication Core Lab
    Deposition and Characterization


    BON-004 Dicing-wafer mount-tape release_nf
    The fully automatic wafer dicing machine model A-WD-2505 is a system for the ultra-high precision dicing of wafer and substrates sized up to 8-inch. It uses a thin two-inch blade rotated at high speeds by an ultra-precise air spindle with a built-in high-speed motor. There are two kinds of blades available to dice Si and glass wafers in NCL. 

    Sample - silicon wafer, III-V materials, glass, patterned wafers.

    Manufacturer: Accretech Europe GmbH
    Model Number: A-WD-2505
    Location: Building 3, Level 0 West

  • Nanofabrication Core Lab
    Deposition and Characterization


    BON-006 Die Attach_nf
    Accessory item of wafer dicing tool (BON-004) to move piece of diced wafer, and will be used together with BON-004. 

    Sample - any wafers.

    Manufacturer: Semiconductor Equipment Corp
    Model Number: 830
    Location: Building 3, Level 0 West

  • Nanofabrication Core Lab
    Deposition and Characterization


    DEP-001 ROTARIS Sputter_nf
    ROTARIS is 8-inch fully automatic nano-coating PVD platform for R&D of ultrathin magnetic films. It includes three process modules, CPM for ultra-thin metal oxidation and wafer pre-clean, sTPM for ultrahigh vacuum annealing, and RSM for ultrathin film deposition with in-situ aligning magnetic field.  It is capable of depositing ultra-thin metallic and insulation layers down to 1 nm with very precise thickness control. NCL provides a number of frequently used targets like Cu, Co, CoFe, CoFeB, Fe, IrMn, MgO, NiFe, Pt, Ru and Ta.

    Sample - 8 inch silicon wafer.


    Manufacturer: Singulus
    Model Number: ROTARIS
    Location: Building 3, Level 0 West

  • Nanofabrication Core Lab
    Deposition and Characterization


    DEP-002 Reactive Sputter_nf
     
    Sputtering is a physical vapor deposition process in which positively charged ions generated in plasma are accelerated by an electrical field to strike the negative target with sufficient energy to dislodge and eject atoms from the target. The ejected atoms condense on substrate to form a thin film. Sputter machine is capable of depositing thin metallic and insulation layers less than 300 nm. The sputtering system has four magnetron sputtering cathodes which accommodate 2 inch diameter targets and can be used with DC or RF sputtering. 
    Available targets at present are SiO2, Mo, Cr and Ti.  




    Sample - a wide range of solid material including silicon, metal, insulator with maximum diameter of 8 inch and maximum thickness of 1 cm. Not applicable for powders, polymers, organics, carbon and toxic materials.

    Manufacturer: ESC
    Model Number: ESCRD4
    Location: Building 3, Level 0 West

  • Nanofabrication Core Lab
    Deposition and Characterization


    DEP-003 Metal Sputter_nf
    Sputtering is a physical vapor deposition process in which positively charged ions generated in plasma are accelerated by an electrical field to strike the negative target with sufficient energy to dislodge and eject atoms from the target. The ejected atoms condense on substrate to form a thin film. Sputter machine is capable of depositing thin metallic and insulation layers less than 300 nm. The sputtering system has four magnetron sputtering cathodes which accommodate 2 inch diameter targets and can be used with DC or RF sputtering. 
    Available targets at present are Ti, Cr, Au, Pt.

    Sample - a wide range of solid material including silicon, metal, insulator with maximum diameter of 8 inch and maximum thickness of 1 cm. Not applicable for powders, polymers, organics, carbon and toxic materials.

    Manufacturer: ESC
    Model Number: ESCRD4
    Location: Building 3, Level 0 West

  • Nanofabrication Core Lab
    Deposition and Characterization


    DEP-007 Ebeam Evaporator_nf
    E-beam evaporator is a physical vapor deposition (PVD) technique, where an intense electron beam is emitted from a filament to strike a source material and vaporize it within a vacuum environment. The vaporized atoms condense on the substrate to form a thin film. The e-beam evaporator has the capability to deposit up to four different materials (metal and oxide) without opening the chamber. Whilst the lab provides standard materials, any specific or expensive materials such as gold and platinum need to be provided by the users themselves.  

    Sample - a wide range of solid materials, not applicable for polymers, powders, organics and toxic materials. Maximum sample diameter is 200 mm, maximum substrate temperature is 400 °C.

    Manufacturer: Denton Vacuum, LLC
    Model Number: EXPLORER14
    Location: Building 3, Level 0 West

  • Nanofabrication Core Lab
    Deposition and Characterization


    DEP-009 Ox-Nitride PECVD_nf
    PECVD is a process by which thin films of various materials from a gas state (vapor) to a solid state can be deposited on substrates at lower temperature than that of standard CVD. In PECVD processes, deposition is achieved by introducing reactant gases between parallel electrodes and the capacitive coupling between the electrodes excites the reactant gases into a plasma, which induces a chemical reaction and results in the reaction product being deposited on the substrate. The substrate, which is placed on the grounded electrode, is typically heated to 250 °C to 350 °C, depending on the specific film requirements.

    Sample - silicon dioxide (SiO2), silicon nitride (SiNx) film can be deposited on to any material. Do not put liquids or powders.

    Manufacturer: Oxford Instruments
    Model Number: Plasmalabsystem100
    Location: Building 3, Level 0 West