Plankton nets
DIAMETER 400
MICRAS 20

Plankton nets
DIAMETER 400
MICRAS 50

Plankton nets
DIAMETER 400
MICRAS 50

The KEM DA 645 density/specific gravity meter measures density of liquid samples with precision in a short span of time. It is based on the oscillating U-tube technique where a U-shape tube is electronically excited to oscillate at its characteristic frequency. When filled with liquid sample, the resonant frequency changes inversely proportional to the square root of sample mass. At giving sample volume (volume of the tube is fixed), through precise measurement of the oscillation frequency the density of liquid sample is derived. Density meters using the oscillating U-tube method allow for highly accurate, reproducible and fast measurement at controlled temperature.

Sputtering is a physical vapor deposition process in which positively charged ions generated in plasma are accelerated by an electrical field to strike the negative target with sufficient energy to dislodge and eject atoms from the target. The ejected atoms condense on substrate to form a thin film. Sputter machine is capable of depositing thin metallic and insulation layers less than 300 nm. The sputtering system has four magnetron sputtering cathodes which accommodate 4 inch diameter targets and can be used with DC or RF sputtering.
Available targets at present are Pt, Au, Cr and Ti.
Sample - a wide range of solid material including silicon, metal, insulator with maximum diameter of 8 inch and maximum thickness of 1 cm. Not applicable for powders, polymers, organics, carbon and toxic materials.

Autoclave

Sputtering is a physical vapor deposition process in which positively charged ions generated in plasma are accelerated by an electrical field to strike the negative target with sufficient energy to dislodge and eject atoms from the target. The ejected atoms condense on substrate to form a thin film. Sputter machine is capable of depositing thin metallic and insulation layers less than 300 nm. The sputtering system has four magnetron sputtering cathodes which accommodate 4 inch diameter targets and can be used with DC or RF sputtering.
Available targets at present are Ti, Cr, SiO2, Mo.
Sample - a wide range of solid material including silicon, metal, insulator with maximum diameter of 8 inch and maximum thickness of 1 cm. Not applicable for powders, polymers, organics, carbon and toxic materials.

E-beam evaporator is a physical vapor deposition (PVD) technique, where an intense electron beam is emitted from a filament to strike a source material and vaporize it within a vacuum environment. The vaporized atoms condense on the substrate to form a thin film. The e-beam evaporator has the capability to deposit up to four different materials (metal and oxide) without opening the chamber. Whilst the lab provides standard materials, any specific or expensive materials such as gold and platinum need to be provided by the users themselves.
Sample - a wide range of solid materials, not applicable for polymers, powders, organics and toxic materials. Maximum sample diameter is 200 mm, maximum substrate temperature is 400 deg-C.

Model 626 is a deep access, long reach wire bonder that can operate as a ball, wedge, bump or peg bonder. It is specifically designed for applications that require bonding at extreme height differences between 1st and 2nd bond and for bonding wires to sensitive devices such as gallium arsenide FETs and LEDs.
Sample - clean metal, silicon, III-V materials. Not applicable for glass and polymers.

Model 626 is a deep access, long reach wire bonder that can operate as a ball, wedge, bump or peg bonder. It is specifically designed for applications that require bonding at extreme height differences between 1st and 2nd bond and for bonding wires to sensitive devices such as gallium arsenide FETs and LEDs.
Sample - clean metal, silicon, III-V materials. Not applicable for glass and polymers.

The fully automatic wafer dicing machine model A-WD-2505 is a system for the ultra-high precision dicing of wafer and substrates sized up to 8-inch. It uses a thin two-inch blade. There are two types of blade available for dicing Silicon and glass wafers.
Sample - silicon wafer, III-V materials, glass, patterned wafers.
#saw
#cutting
#dicing

Chemical Mechanical Planarization (CMP) is a polishing process that utilizes an abrasive chemical slurry and mechanical process to remove unwanted materials on a silicon wafer. It can achieve a smooth surface on which further processing can be done. The wafer is pressed down to the pad by a polishing head and the head is rotated with different axis of rotation. The slurry is continuously flowed around the polishing head. The slurries available at the cleanroom are for Silicon/silicon oxide, copper and tungsten.
Sample - Silicon wafer from 3-inch to 8 inches.
#polish
#lapping
#thinning

Accessory item of wafer dicing tool (BON-004) to move piece of diced wafer, and will be used together with BON-004.
Sample - any wafers.

Wafer bonding is a process by which two wafers of any materials adhere to each other either with macroscopic gluing, external force or voltage. It can be done at room temperature or elevated temperatures based on the requirement. The EVG 520IS is a semi-automated single-chamber unit with controlled piston pressure, vacuum, temperature and voltage, which can handle adhesive bonding, anodic bonding and hot embossing of 4, 6 and 8 inch wafers.
Wafer - 4, 6, or 8 inches of silicon and glass wafers.

The exposed photo-resist is dissolved by the developer and essentially the pattern on the mask is transferred to the wafer. The solvent develop hood is equipped with the standard developers like AZ, AZ400K and AZ726MIF.
Wafer - a wide range of wafers with dimensions between 1 and 8 inches.

The Solvent Strip hood is used to remove polymers like photo-resist, PMMA, SU-8 etc completely from the wafer. It employs a variety of chemicals like acetone, IPA, DMSO and photo-resist strippers.
Wafer - a wide range of materials with dimensions between 1 and 8 inches.

The exposed photo-resist is dissolved by the developer and essentially the pattern on the mask is transferred to the wafer. The base develop hood is equipped with the standard developers like AZ, AZ400K and AZ726MIF.
Wafer - a wide range of wafers with dimensions between 1 and 8 inches.

UV cure is a flood exposure system to instantly cure or dry inks, coatings or adhesives using high-intensity ultraviolet light. It generates a photo-chemical reaction that generates a cross-linked network of polymers. It is equipped with 365 nm wavelength UV lamp with a 20 mW/cm2 power density.
Wafer - any materials with photoresist.

The solvent hood with ultrasonic is primarily used for thin-film lift-off with ultrasonic waves. Acetone is the most commonly used solvent. Further, it can also be used to clean small parts in acetone or IPA (for example ink-jet nozzles) where ultrasonic wave sound pressure might be needed.
Wafer - a wide range of materials with dimensions between 1 and 8 inches.

The contact aligner is used for exposure of wafers. Shining a UV light through a chrome mask to a photo-resist coated wafer exposes the photo-resist not covered by the chrome in the mask. The exposed photo-resist is dissolved by the developer and essentially the pattern on the mask is transferred to the wafer. Contact aligners can also align previously patterned marks on the substrate to a different mask during further exposure steps. Support for both front-side and back-side alignment are present in the EVG 6200 and it is capable of 1 micron feature resolution. It can accommodate substrates up to 8-inches in diameter and mask sizes 5, 7 and 9-inches.
Sample - silicon, glass, compound semiconductors with wafer dimensions between 10x10 mm and 8 inches.
#Lithography