The System is surface-analyzing equipment featuring the high resolution Rutherford Backscattering (RBS) method, utilizing a spectrometer and position-sensitive detector to analyze scattered ions, which can achieve depth profile resolution of the thin films. The system is incomparably lighter and smaller than the conventional RBS systems, while maintaining the advantages in the quantitative, nondestructive, and rapid analysis offered by the conventional RBS systems.
The primary use is the measurement of film compositions and depth profiles using He ion with energy of up to 500 keV.
Sample - thin films with thickness less than 200 nm and preferred dimension 4 - 10 mm.

The JetFirst 200C system is an advanced bench-top Rapid Thermal Processing (RTP) system with multi-gas capabilities, such as O2, Ar, and H2. The tool is equipped with closed loop temperature control set by either a thermocouple or optical pyrometer. The system consists of a cold-wall reaction chamber for wafer up to 200mm in diameter, and a powerful infrared lamps furnace with an integrated computer control system and software interface to provide simple recipe programming and full process monitoring.
Sample # Thin film

SQUID-VSM is a high sensitive (10-8 emu) magnetometer to study the magnetic properties of various types of materials, such as Para-, Ferro-, Ferri-, Antiferro-, superpara- magnetic, as a function of two main variables; (i) Magnetic field, +/- 7 T and (ii) Temperature, 2 K 400 K 1000 K. Superconducting materials and magneto-caloric materials can also be studied using this tool. Sample space is ~7mm in diameter. Solid, thin film or powder samples can be studied. Liquid samples need special preparation.
Sample:- Solid or powder sample ~ 50 mg minimum. Maximum dimension of Thin film sample ~ 5 mm x 10 mm. Weakly magnetic or diluted magnetic thin films should not be handled by metal tools or double sided tape or any stationery glue or ink prior to the measurement.

The Aixacct Systems TF Analyzer 2000 is an efficient tool for performing electric measurements. It is capable of analyzing bulk ceramic pieces, wafers and thin films. It can also measure DC and AC impedance at voltages up to 2 kV and frequencies between 20 Hz and 10 MHz. It is, therefore, well suited to measuring the ferroelectric properties and estimating the strain in materials.
Sample - thin film wafers.

The Aixacct Systems TF Analyzer 2000 is an efficient tool for performing electric measurements. It is capable of analyzing bulk ceramic pieces, wafers and thin films. It can also measure DC and AC impedance at voltages up to 2 kV and frequencies between 20 Hz and 10 MHz. It is, therefore, well suited to measuring the ferroelectric properties and estimating the strain in materials.
Sample - ceramic plate and thin film wafers.

Vibrating sample magnetometer (VSM) is a tool to characterize various type of magnetic materials such as Dia / Para / Ferro / Ferri / Antiferro / Superpara-magnetic ground states. It is equipped with an electromagnet and a pick-up coil with a sensitivity of 10-6 emu. Samples can be in solid, thin film, powder or in liquid form. Special holders are available for in-plane and out-of-plane magnetization geometry for anisotropic magnetic materials. Maximum applied field that depends on the pole gap is +/- 1.5 Tesla. A low temperature option up to 77K is available. High temperature attachment to reach up to 1000 K is also available.
Sample - Solid sample ~ 50 mg minimum. Thin film sample ~ 5 mm x 10 mm of maximum dimension. Thin films should not be handled by metal tool / double sided tape or any glue or ink prior measurement for weakly magnetic thin films.

Plankton nets
DIAMETER 1000
MICRAS 1000

Plankton nets
DIAMETER 600
MICRAS 200

Plankton nets
DIAMETER 600
MICRAS 200

Plankton nets
DIAMETER 600
MICRAS 100

Plankton nets
DIAMETER 600
MICRAS 100

Plankton nets
DIAMETER 600
MICRAS 100

The Micro radiometric thermal imaging microscope measures and displays the temperature distribution over the surface of small devices. This enables quick detection of hot spots and thermal gradients, which may indicate a defect site and frequently lead to decreased efficiency and early failure.
Features and Capabilities
- True temperature mapping using Emissivity Tables.
- Analyze thermal images using region statistics.
- Record thermal movies with sequence analysis.
- Temperature graphing and charting.

The Ytterbium fiber is transparent to glass and PMMA, but absorbent to metals. The wavelength is 1060 nm and suitable for cutting 200 micron thick sheets of brass, copper, bronze and gold and is able to do wafer dicing. When combining thin film layers of sputtered metals on PET or glass, differential laser etching may be achieved, whereby the metal is removed, without any damage to the polymer or glass. The software used to design the print folder is Coral Draw, which also incorporates a DXF format.
Sample - Wafer dicing, thin metal sheet cutting, flexible electronics and metal engraving.
#dicing
#cutting

The Alpha-Step D-120 brings high resolution 2D & 3D profiling, 2D stress and profile stitching. The D-120 utilizes an innovative optical lever technology to provide the most sensitive low noise, low mass sensor over the widest z-range of is class, providing a unique integrated design low force sensor, 0.03mg - 10mg, standard on each tool. With its motorized 150 X 178mm X-Y stages, the D-120 can be programmed to automatically make measurements at up to 999 different locations on the sample. As an added feature, the D-120 incorporates a 4X motorized zoom camera for highly versatile sample visualization.
D-120 Stylus Profiler Specifications:
- Highest vertical range at 1200 um
- Low force measurements at 0.03 to 15 mg
- Step height repeatability of 5 A on a 1 um step
- High resolution 5 MP color camera with 4x digital zoom
- Intuitive user interface
Sample - metal, silicon, glass, III-V materials with maximum thickness of 25.4 mm (1 inch) and diameter up to 8 inches. Not applicable for extremely rough surface

The Heidelberg uPG 501 is an economical, easy to use laser pattern generator with a 390nm 10W LED source. It can be used to expose photo-resist for patterning chrome on glass photomasks and maskless direct substrate writing on photo resist coated silicon wafers, at feature sizes as small as 1 micron. The laser writer can process substrates up to 100 mm in diameter. The maximum mask size is 5 inches. The allowed data formats are GDS II, CIF and DXF formats.
Sample - silicon wafer and glass chrome masks.
#lithography
#maskless

FEI Dualbeam system combines SEM and FIB together with the capabilities of SEM image, Milling, Deposition, TEM lamella creation and Micro/nano patterning.
FIB is used as a micro- and nano-machining tool to modify materials at the micro and nanoscale. It can also be used to deposit material such as platinum, carbon or gold via ion beam induced deposition. The FIB is commonly used to prepare very thin samples (typically ~100 nanometers) for the transmission electron microscope.
a) Resolution at optimum distance: 5nm @30KV high throughput and high resolution S/TEM sample preparation - High-resolution SEM imaging and energy dispersive X-ray analysis (EDS)
b) Resolution at optimum distance: 0.9nm@15KV,1.4nm@1KV - Flipstage and insitu STEM detector for STEM imaging
c) Resolution at optimum distance: 0.8nm@30KV STEM - GIS system of deposition and enhanced milling for patterning.
Sample - conductive solid materials.

​The Helios G4 is a SEM with FIB capabilities. FIB is used to modify or machine materials at the micro and nanoscale; and to deposit material such as platinum, carbon, gold, etc. via ion beam induced deposition.
The FIB is also commonly used to prepare very thin samples (typically ~100 nanometers) for the transmission electron microscope.
The Helios G4 is equipped with a cryo stage that allows examination of specimens at very low temperature (-180 deg.C).​​​

Scanning electron microscope - SEM - that produces images of a sample by scanning it with a focused beam of electrons. The electrons interact with atoms in the sample, producing various signals that contain information about the sample's surface topography and composition. This is is an ultra-high resolution field emission SEM with UniColor (UC) technology, 2-mode final lens (immersion and field-free), SE/BSE in-lens detection, a solid state concentric backscatter (CBS) detector and beam deceleration capability. Combined, these features help maximize resolution, surface detail and contrast at very low voltages. The EDS attachment allows for elemental identification/localization.
Sample - conductive, semi-conductive and poorly conductive materials in the form of bulk, powders and thin films. These include nano-particles, nano-tubes and -wires, porous materials, plastics, polymers, glass substrates, and organic and inorganic materials.